0015800625 数据表(PDF) - Molex Electronics Ltd.

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0015800625 数据表 (PDF) - Molex Electronics Ltd.

0015800625 Datasheet PDF - Molex Electronics Ltd.


部件名	0015800625

下载	0015800625 下载

文件大小	1229.92 Kbytes

页	7 Pages

制造商	MOLEX2 [Molex Electronics Ltd.]

网页	http://www.molex.com

标志

功能描述	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

0015800625 Datasheet (PDF)

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0015800625 Datasheet PDF - Molex Electronics Ltd.


部件名	0015800625

下载	0015800625 Click to download

文件大小	1229.92 Kbytes

页	7 Pages

制造商	MOLEX2 [Molex Electronics Ltd.]

网页	http://www.molex.com

标志

功能描述	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

0015800625 数据表 (HTML) - Molex Electronics Ltd.

0015800625 Datasheet HTML 1Page - Molex Electronics Ltd.

0015800625 Datasheet HTML 2Page - Molex Electronics Ltd.

0015800625 Datasheet HTML 3Page - Molex Electronics Ltd.

0015800625 Datasheet HTML 4Page - Molex Electronics Ltd.

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0015800625 Datasheet HTML 6Page - Molex Electronics Ltd.

0015800625 Datasheet HTML 7Page - Molex Electronics Ltd.

类似零件编号 - 0015800625

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0015800621	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.	0015800623	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

类似说明 - 0015800625

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0015800305	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015801501	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015801221	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015800265	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015801121	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015801201	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m (30關) Gold, (Au) Selective Plating
	0015800585	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015800705	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015800665	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
	0015800185	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76關m (30關) Gold (Au) Selective Plating

关于 Molex Electronics Ltd.

Molex Electronics Ltd.是Koch Industries，Inc。的子公司，是电子和光纤互连解决方案的全球制造商。

该公司成立于1938年，总部位于伊利诺伊州的Lisle。

Molex提供各种互连产品，包括连接器，电缆组件，开关和其他被动组件。

这些产品用于各种行业，包括汽车，数据通信，消费电子，工业设备，医疗设备和电信。

Molex拥有40多个国家 /地区的运营和设施，以其在互连解决方案市场中的创新和技术领导而闻名。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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