| 制造商 | 部件名 | 数据表 | 功能描述 |

Microchip Technology
|
AC162061 |
183Kb/12P |
Header Specification 08/24/05 |
| AC162059 |
782Kb/78P |
Debug Header Specification 2006-2012 |

Molex Electronics Ltd.
|
PK-5569-002 |
123Kb/2P |
BULK PACKAGING SPECIFICATION FOR: 5569, 45558 & 172648 HEADER ASS’YS 2015/08/24 |

Shanghai Leiditech Elec...
|
SMD4532-400 |
271Kb/3P |
SPECIFICATION ELECTRICAL SPECIFICATION |

Molex Electronics Ltd.
|
62201-6100 |
312Kb/14P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet 3-15-10 |
| 62201-6010 |
275Kb/8P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet 3-15-10 |
| 62201-6000 |
270Kb/12P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet 3-15-10 |

Samsung semiconductor
|
CL10A226MQ8NRNE |
140Kb/2P |
SPECIFICATION |
| CL21B105KBFNNNF |
139Kb/2P |
SPECIFICATION |
| CL21B473KCFNNNE |
140Kb/2P |
SPECIFICATION |

List of Unclassifed Man...
|
ISR3SAD100 |
93Kb/1P |
SPECIFICATION |

Samsung semiconductor
|
CL05A474KQ5NNNC |
135Kb/2P |
SPECIFICATION |
| CL05A475MP5NRNC |
169Kb/2P |
SPECIFICATION |
| CL05C100JB5NNNC |
82Kb/2P |
SPECIFICATION |
| CL31A226KAHNNNE |
80Kb/2P |
SPECIFICATION |
| CL31A226KQHNNNE |
80Kb/2P |
SPECIFICATION |
| CL31B105KCHSNNE |
152Kb/2P |
SPECIFICATION |

Fuji Electric
|
PH967C6 |
136Kb/12P |
SPECIFICATION |

Vectron International, ...
|
TFS71D |
37Kb/3P |
Specification |
| TFS161A |
39Kb/5P |
Specification |