| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0685610021 |
89Kb/2P |
1.27mm (.050") Pitch Serial ATA Power Latching Harness-to-Pigtail, IDT, 1.50m (4.92 )Length, 0.76關m (30關") Gold (Au), 5V+12V, Leadfree |
| 0717422002 |
162Kb/4P |
1.00mm (.039") Pitch Mezzanine Receptacle, Surface Mount, Dual Row, VerticalStacking, 7.30mm (.406") Stack Height, 84 Circuits, 0.25關m (10關") Gold Plating, Tube |
| 0717422003 |
162Kb/4P |
1.00mm (.039) Pitch Mezzanine Receptacle, Surface Mount, Dual Row, Vertical Stacking, 7.30mm (.406) Stack Height, 84 Circuits, 0.76關m (30關) Gold Plating |
| 0740298050 |
153Kb/3P |
2.00mm (.079) Pitch VHDM짰 Board-to-Board Backplane Receptacle Power Module, Vertical, 8-Row, 3 Circuits, Gold (Au) Selective 1.27關m (50關) |
| 0743232004 |
225Kb/4P |
MicroCross??DVI Digital Dual Link Component, High Volume Plug Connector SubassemblyVertical, 0.76關m (30關") Gold (Au), with key, 24 Circuits, Lead Free |
| 0743232034 |
226Kb/4P |
MicroCross??DVI Digital/Analog Dual Link Component, High Volume Plug ConnectorSub-assembly, Vertical, Gold (Au) 0.76關m(30關"), 29 Circuits, Lead Free |
| 0685610019 |
91Kb/2P |
1.27mm (.050") Pitch Serial ATA IDT Power Latching Adapter Cable Assembly, 0.152m(6.00") Length, 0.76關m (30關") Gold (Au), 5V+12V, Leadfree |
| 0740950080 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits,0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0741620438 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 38 Circuits, 0.8關m (30關") Gold (Au |
| 0717640128 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 28 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0740571004 |
280Kb/5P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 6-RowOpen Signal Module, 60 Circuits, 10 Columns, Pin Length 5.15mm (.203"), 0.76關m |
| 0741620216 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 16 Circuits, 0.4關m (15關") Gold (Au) |
| 0741620210 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 10 Circuits, 0.4關m (15關") Gold (Au |
| 0741620208 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 8 Circuits, 0.4關m (15關") Gold (Au) |
| 0741620410 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 10 Circuits, 0.8關m (30關") Gold (Au) |
| 0741620240 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 40 Circuits, 0.4關m (15關") Gold (Au) |
| 0717640112 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0702461404 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 14Circuits, 0.127關m (5關") Gold (Au) Plating, Tin (Sn) PC TailPlating |
| 0743201033 |
206Kb/4P |
MicroCross??DVI-I Digital/Analog Visual Interface, PCB Receptacle, Through Hole, Right Angle, with Shielding, without Screw, 0.76關m (30關) Gold (Au) Plating |
| 0717640224 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 24 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
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