| 制造商 | 部件名 | 数据表 | 功能描述 |

Molex Electronics Ltd.
|
0705550052 |
329Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 18 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin |
| 0705450085 |
263Kb/5P |
2.54mm (.100") Pitch SL??Header, Single Row .120" Pocket Vertical, Shrouded, withPress-fir Plastic Peg, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) |
| 0705550082 |
329Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 13 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin |
| 0741640050 |
403Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded with Pegs, Version A, High-Temperature, 50 Circuits, 0.4關m (15關") Gold (Au |
| 0705750074 |
261Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 5 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin |
| 0702462602 |
187Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 26 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0702871210 |
319Kb/6P |
2.54mm (.100") Pitch C-Grid짰 Header, Breakaway, Dual Row, Vertical, with RetentionPin, 32 Circuits, 6.10mm (.240") Mating Pin Length, 0.76關m (30關") Gold (Au) Selective Plating |
| 0713492086 |
432Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
| 0743232052 |
231Kb/4P |
MicroCross??DVI Digital Single Link, High Volume Plug Connector Sub- assembly, ESD Type, 0.76關m (30關") Gold (Au) Plating, Vertical, with key, 18 Circuits, Lead Free |
| 0713491076 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0713491049 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 34 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0741640008 |
403Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded with Pegs, Version A, High-Temperature, 8 Circuits, 0.4關m (15關") Gold (Au) |
| 0713491078 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 24 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0676431931 |
180Kb/4P |
Universal Serial Bus (USB) Shielded I/O Receptacle, Right Angle, Type A, High-Temperature White Nylon, 0.76關m (30關") Gold (Au) Plating, PCB Thickness 1.20mm (.047") |
| 0713491050 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded, 36 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0741640044 |
403Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded with Pegs, Version A, High-Temperature, 44 Circuits, 0.4關m (15關) Gold (Au) |
| 0705550054 |
329Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin |
| 0705550094 |
329Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .120" Pocket, Shroudedwith Press-fit Plastic Peg, 25 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin |
| 0705750085 |
261Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Right Angle, .180" Pocket, Shroudedwith Press-fit Plastic Peg, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin |
| 0713491051 |
433Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, Shrouded,38 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, without Press-fit Plastic Pegs |