| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0701070048 |
178Kb/4P |
2.54mm (.100") Pitch SL??Wire-to-Wire Panel Mount Crimp Housing, Single Row,Version B, With Mounting Ears, 14 Circuits |
| 0741621024 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 24 Circuits, Tin (Sn |
| 0701070046 |
178Kb/4P |
2.54mm (.100") Pitch SL??Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 12 Circuits |
| 0701070057 |
178Kb/4P |
2.54mm (.100") Pitch SL??Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 23 Circuits |
| 0741621048 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 48 Circuits, Tin (Sn) |
| 0701070038 |
178Kb/4P |
2.54mm (.100") Pitch SL??Wire-to-Wire Panel Mount Crimp Housing, Single Row,Version B, With Mounting Ears, 4 Circuits |
| 0741621032 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 32 Circuits, Tin (Sn) |
| 0741621014 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 14 Circuits, Tin (Sn) |
| 0741621022 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 22 Circuits, Tin (Sn) |
| 0741621030 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 30 Circuits, Tin (Sn) |
| 0741621018 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 18 Circuits, Tin (Sn) |
| 0741621072 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 72 Circuits, Tin (Sn |
| 0741621040 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version B, High-Temperature, 40 Circuits, Tin (Sn) |
| 0741621016 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 16 Circuits, Tin (Sn) |
| 0741621008 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version B, High-Temperature, 8 Circuits, Tin (Sn) |
| 0736441006 |
178Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits |
| 0736441008 |
178Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 144 Circuits |
| 0736440008 |
178Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 72 Circuits |
| 0736442200 |
175Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits |
| 0736442212 |
185Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits |
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