| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0741620412 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 12 Circuits, 0.8關m (30關") Gold (Au |
| 0741621422 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 22 Circuits, 0.8關m (30關") Gold (Au) |
| 0741621234 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 34 Circuits, 0.4關m (15關") Gold (Au |
| 0741620256 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 56 Circuits, 0.4關m (15關") Gold (Au |
| 0717640216 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620416 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 16 Circuits, 0.8關m (30關") Gold (Au |
| 0717640222 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, DualRow, Right Angle,High Temperature, 22 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620440 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 40 Circuits, 0.8關m (30關") Gold (Au |
| 0741621250 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 56 Circuits, 0.4關m (15關") Gold (Au |
| 0717640212 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 12 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620468 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 68 Circuits, 0.8關m (30關") Gold (Au |
| 0741621420 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 20 Circuits, 0.8關m (30關") Gold (Au) |
| 0743209133 |
217Kb/4P |
MicroCross??DVI-I Digital/ Analog Interface, PCB Receptacle, Panel Mount, ThroughHole, Right Angle, with Beveled Metal Pins, Jack Screws, and Back Shield, 0.76關m |
| 0717640126 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 26 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0717640204 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right AngleHigh Temperature, 4 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0741620260 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 60 Circuits, 0.4關m (15關") Gold (Au |
| 0741620218 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version A, High-Temperature, 18 Circuits, 0.4關m (15關") Gold (Au) |
| 0741621210 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual RowShrouded, Version B, High-Temperature, 10 Circuits, 0.4關m (15關") Gold (Au) |
| 0740571003 |
280Kb/5P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 6-RowOpen Signal Module, 60 Circuits, 10 Columns, Pin Length 4.75mm (.167"), 0.76關m |
| 0685610023 |
90Kb/2P |
1.27mm (.050") Pitch Serial ATA Power Latching Harness-to-Pigtail, IDT, 1.50m (4.92 )Length, 0.76關m (30關") Gold (Au), 3.3V+5V+12V, Leadfree |
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