| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0736442216 |
185Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
| 0736446216 |
193Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits |
| 0736440216 |
178Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
| 0736440116 |
178Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
| 0736442116 |
174Kb/4P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits |
| 0678007001 |
194Kb/4P |
1.27mm (.050") Pitch Serial ATA High Speed Header, Vertical, Through Hole, withLocking Latch, 7 Circuits, Gold (Au) Flash, for 1.60mm (.063") PCB, Black, Footprint B |
| 0713086478 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50關m (59u") Minimum |
| 0713085438 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50關m (59u") Minimum |
| 0713086418 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50關m (59u") Minimum |
| 0678007081 |
196Kb/4P |
1.27mm (.050") Pitch Serial ATA High Speed Header, Vertical, Through Hole, with Locking Latch, 7 Circuits, Gold (Au) Flash Plating, for 2.40mm (.094") PCB,Blue,Footprint B |
| 0743232012 |
226Kb/4P |
MicroCross??DVI Analog, High Volume Plug Connector Sub-assembly, Vertical0.76關m (30關") Gold (Au), 17 Circuits, Lead Free |
| 0744410017 |
482Kb/9P |
0.80mm (.031") Pitch XFP Host Connector, Z-Axis Pluggable, Right Angle, SMT, 30Circuits, 0.76關m (30關") Gold (Au |
| 0744410007 |
482Kb/9P |
0.80mm (.031") Pitch XFP Host Connector, Z-Axis Pluggable, Right Angle, SMT, 30Circuits, 0.38關m (15關") Gold (Au) |
| 0740621022 |
518Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin Signal Module, Shield End Version, 80 Circuits, Pin Length 6.25mm (.246"), Keying Pin Orientation B |
| 0736590001 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關") |
| 0702460801 |
187Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0736565001 |
403Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736560000 |
355Kb/6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736590002 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關 |
| 0714393164 |
304Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
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