| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0702800481 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 86 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0741620214 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version A, High-Temperature, 14 Circuits, 0.4關m (15關") Gold (Au) |
| 0713085458 |
1Mb/8P |
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 1.50關m (59關) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating |
| 0741620470 |
1Mb/10P |
2.54mm (.100) Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row, Shrouded, Version A, High-Temperature, 70 Circuits, 0.8關m (30關) Gold (Au) |
| 0741620264 |
1Mb/10P |
2.54mm (.100") Pitch C-Grid짰 Receptacle, Right Angle, Through Hole, Dual Row,Shrouded, Version A, High-Temperature, 64 Circuits, 0.4關m (15關") Gold (Au) |
| 0702800496 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 96 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0702800463 |
294Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail |
| 0717640108 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 8 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0717640124 |
131Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0705419043 |
167Kb/4P |
2.54mm (.100) Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, with Straight Plastic Peg, 9 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0705430126 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 22Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0714392864 |
303Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Embossed Tape on Reel, 0.76關m (30關") Gold (Au), 64 Circuits Pick |
| 0705430001 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 2Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705430014 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 15Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705430123 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 19Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705630122 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 18Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0717640104 |
132Kb/5P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Low Profile, Dual Row, Right Angle,High Temperature, 4 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0705630014 |
225Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .180" Pocket, Shrouded, 15Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0705430110 |
429Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, .120" Pocket, Shrouded, 6Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating |
| 0678008075 |
213Kb/4P |
1.27mm (.050") Pitch Serial ATA High Speed Header, Vertical, Through Hole, withLocking Latch, 7 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, for 1.60mm |
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