| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0714393564 |
195Kb/3P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0736561000 |
414Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0714390164 |
325Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0714391564 |
314Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0740950050 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0740298000 |
237Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Receptacle Power ModuleVertical, 8-Row, 3 Circuits, Gold (Au) Selective 0.76關m (30關") |
| 0736562001 |
409Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736560180 |
399Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 2 Circuits, Gold (Au) 0.76關m (30關") |
| 0743209006 |
108Kb/2P |
MicroCross??DVI-D Digital Visual Interface, PCB Receptacle, Panel Mount, ThroughHole, ATX with Beveled Metal Pins, Right Angle, 0.76關m (30關 |
| 0736560190 |
116Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 1 Circuits, Gold (Au) 0.76關m (30關") |
| 0702800460 |
294Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 84 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0740950055 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0740950046 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 16 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0744410001 |
817Kb/15P |
0.80mm (.031") Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, RightAngle, SMT, 20 Circuits, 0.38關m (15關") Gold (Au) |
| 0740950085 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 25 Circuits0.76關m (30關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0736590003 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC, Power Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關") |
| 0744410010 |
481Kb/9P |
0.80mm (.031") Pitch SFP, SFP Plus (SFP+) Host Connector, Z-Axis Pluggable, RightAngle, SMT, 20 Circuits, 0.76關m (30關") Gold (Au) |
| 0714391164 |
314Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0736562000 |
413Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0740296000 |
309Kb/6P |
2.00mm (.079) Pitch VHDM짰 Board-to-Board Backplane Receptacle Power Module, Vertical, 6-Row, 2 Circuits, Gold (Au) Selective 0.76關m (30關) |
Chinese ▼ 
English
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
