| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0753414467 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416464 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077021 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating |
| 0753416744 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0754921044 |
281Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 2-Pair GbX짰 Backplane Connector System, Power Module, 4 Circuits, 1.27關m (50關) Gold (Au) |
| 0791077266 |
278Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.76關m (30關) Gold (Au) Selective Plating |
| 0753417746 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753414664 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0753416676 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877582850 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753310464 |
339Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 3-Pair GbX짰 Backplane Connector System, Power Module, 6 Circuits,1.27關m (50關) Gold (Au) |
| 0755177644 |
332Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 5-Pair GbX짰 Backplane Connector System, Power Module, 10 Circuits, 1.27關m (50關) Gold (Au) |
| 0877581650 |
147Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0753416644 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073) Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關) Gold (Au) |
| 0877583850 |
147Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 38 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tray Packaging, Lead-free |
| 0850010086 |
208Kb/6P |
2.54mm (.100") Pitch DIN 41612 B Style Male Header, PCT, Right Angle, Through Hole, 0.60關m (24關") Selective Gold (Au) Plating, 32 |
| 0753414466 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System, Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0757840132 |
1Mb/14P |
0.80mm (.031") Pitch, iPass??I/O SMT Receptacle, Vertical, Internal Application, 36Circuit, 0.38關m (15關") Gold (Au), Through Hole Shell, Universal Key |
| 0753416447 |
315Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 4-Pair GbX짰 Backplane Connector System,Power Module, 12 Circuits, 1.27關m (50關") Gold (Au) |
| 0850030610 |
84Kb/3P |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Right Angle, Through Hole, 1關m (40關") Selective Gold (Au), 64 Circuits, Lead free |
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