| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0749790909 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 36 Circuits, Gold (Au) Selective 1.27關m (50關), Pin Length 5.15mm (.203) |
| 0877159900 |
143Kb/3P |
1.00mm (.039) Edgecard Connector, Vertical, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating, with Plastic Pegs |
| 0877585016 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877159402 |
348Kb/6P |
1.00mm (.039) Pitch, PCI Express* Connector, 36 Circuits, Nylon 4/6 Glass-filled, Black Housing, Phosphor Bronze, 0.38關m (15關) Gold (Au) Plating |
| 0872631493 |
367Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關) Gold (Au) Selective, 14 Circuits, with Pick-and-Place Cap |
| 0877582016 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0749790902 |
423Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 36 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 6.25mm (.246) |
| 0749792503 |
421Kb/4P |
2.00mm (.079) Pitch 6-Row VHDM-HSD??Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76關m (30關), Pin Length 4.25mm (.167) |
| 0876161001 |
239Kb/5P |
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??(SSI) MPS Receptacle, Through Hole, Right Angle, 0.76關m (30關) Gold (Au) Plating |
| 0877159913 |
371Kb/5P |
1.00mm (.039) Pitch, PCI Express* Connector, 164 Circuits, Nylon 4/6 Glass-filled, Black Housing, Copper Alloy, 0.76關m (30關) Gold (Au) Plating |
| 0877580416 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0873811218 |
126Kb/3P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Top Entry, 0.38關m (15關") Gold (Au) Plating, without Cap, with Locating Peg, 12 Circuits |
| 0780790002 |
820Kb/10P |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.38關m (15關") Gold (Au) Plating |
| 0780790021 |
822Kb/10P |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.076關m (3關") Gold (Au) Plating |
| 0872632893 |
367Kb/5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Surface Mount, Bottom Entry, 0.38關m (15關") Gold (Au) Selective, 28 Circuits, with Pick-and-Place Cap |
| 0877583016 |
182Kb/4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0754921035 |
282Kb/6P |
1.85mm by 1.85mm (.073 by .073") Pitch 2-Pair GbX짰 Backplane Connector SystemPower Module, 4 Circuits, 1.27關m (50關") Gold (Au), Lead Free |
| 0791081006 |
304Kb/6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row ThroughHole, 0.38關m (15關") Gold (Au) Selective Plating, 14 Circuits, Leadfree |
| 0877581816 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 18 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
| 0877581217 |
182Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free |
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