| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0905711601 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 60 Circuits, 0.1 關m Gold (Au) |
| 0901362306 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0905711641 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 關m Gold (Au) |
| 0901362203 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 3 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0877602218 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 22 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 0901362309 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 9 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0901362206 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0905711261 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.1 關m Gold (Au) |
| 0905711401 |
294Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 40 Circuits, 0.1 關m Gold (Au) |
| 0878910106 |
770Kb/10P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 1 Circuit, 2.50 關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free |
| 0877601218 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tray, Lead-free |
| 0905711502 |
286Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 50 Circuits, 0.76 關m Gold (Au) |
| 0878910408 |
299Kb/5P |
2.54mm (.100) Pitch KK짰 Header, Through Hole, Vertical, 4 Circuit, 2.50關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free |
| 0885264602 |
85Kb/2P |
MT-RJ(F)-to-MT-RJ(F), Singlemode, 9/125關m/G652, Duplex, 1.60mm (.063), Standard Fiber Optic Cable Assembly, 3.0m (9.84) |
| 0901362302 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878334220 |
268Kb/4P |
2.00mm Pitch Milli-Grid Header, Right Angle, Shrouded, Lead-free, 42 Circuits, 0.38關m Gold (Au) Plating, without PCB Locator, with Locking Windows, |
| 0905722641 |
280Kb/3P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 關m Gold (Au) |
| 0878320609 |
224Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.76關m (30關) Gold (Au) Plating, with Locking Window |
| 0878311241 |
147Kb/3P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Leadfree 12 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Window |
| 0877604616 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 46 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
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