| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0905721162 |
219Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 16 Circuits, 0.76 關m Gold (Au) |
| 0901361132 |
171Kb/4P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, Shrouded, 32 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0905722343 |
280Kb/5P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 34 Circuits, 0.25 關m Gold (Au) |
| 0879111014 |
197Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, Lead-free |
| 0878320614 |
357Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 6 Circuits, 0.38關m (15關) Gold (Au) Plating, without Locking Window |
| 0905722201 |
288Kb/5P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 20 Circuits, 0.1 關m Gold (Au) |
| 0877602817 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 28 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
| 0877601216 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 0878331220 |
268Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Shrouded, Lead-free, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, without PCB Locator |
| 0905722202 |
280Kb/5P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 20 Circuits, 0.76 關m Gold (Au) |
| 0878321614 |
357Kb/5P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 16 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Windows |
| 0878320408 |
227Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 4 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Window |
| 0877600416 |
167Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 4 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 0878336020 |
267Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Shrouded, Lead-free, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, without PCB Locator |
| 0878321007 |
224Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 10 Circuits, 0.76關m (30關) Gold (Au) Plating, with Locking Window |
| 0905722261 |
288Kb/5P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 26 Circuits, 0.1 關m Gold (Au) |
| 0878030152 |
360Kb/7P |
1.00mm (.039) Pitch DDR2 DIMM Socket, Through Hole, 25째 Angle, 0.76關m (30關) Gold (Au), 4.00mm (0.157) Soldertail, 240 Circuits, Lead free |
| 0877602016 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 0879148016 |
3Mb/48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Lead-free |
| 0877602017 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tray, Lead-free |
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