| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0878331020 |
268Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Shrouded, Lead-free, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, without PCB Locator |
| 0878320606 |
227Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 6 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Window |
| 0905721641 |
227Kb/4P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.1 關m Gold (Au) |
| 0878321243 |
233Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 12 Circuits, 0.76關m (30關) Gold (Au) Plating, with Locking Window |
| 0877603816 |
172Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Right Angle, Through Hole, 38 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tray, Lead-free |
| 0905722601 |
288Kb/5P |
2.54mm (.100) Pitch QF-50??Header, Right Angle, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 60 Circuits, 0.1 關m Gold (Au) |
| 0901361114 |
171Kb/4P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, Shrouded, 14 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0879113607 |
498Kb/7P |
2.54mm (.100") Pitch C-Grid짰 Header, Right Angle, Through Hole, 36 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0901362112 |
266Kb/5P |
2.54mm (.100") Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 12 Circuits, 4關m (160關") Tin/Lead (Sn) over Nickel (Ni) |
| 0879116011 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 60 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878312020 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 20 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0901301306 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878311420 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 14 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot, |
| 0878322023 |
398Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 20 Circuits, 0.76關m (30關) Gold (Au) Plating, Pick-and-Place Cap |
| 0877594465 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0879114811 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878314020 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free 40 Circuits, 0.38關m (15關") Gold (Au) Plating, Center Polarization Slot |
| 0878320838 |
222Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 8 Circuits, 0.38關m (15關) Gold (Au) Plating, with Central Locking Window |
| 0878312220 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 22 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0877822003 |
561Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR2, Socket, Surface Mount, Vertical, 1.8V Voltage Key, 244 Circuits, 0.76關m (30關) Gold (Au) Plating, Off- White Latches |
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