| 制造商 | 部件名 | 数据表 | 功能描述 |

Molex Electronics Ltd.
|
0878981066 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 10 Circuits, 2.54關m (100關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free |
| 0877822001 |
557Kb/8P |
0.60mm (.024) Pitch miniDIMM DDR2, Socket, Surface Mount, Vertical, 1.8V Voltage Key, 244 Circuits, 0.76關m (30關) Gold (Au) Plating, Off- White Latches |
| 0877592075 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 20 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0879114411 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 44 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0901362102 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 2 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0879141001 |
770Kb/11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free |
| 0879118011 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 80 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878311620 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 16 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot, |
| 0879111011 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 10 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878980624 |
1Mb/22P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 6 Circuits, 0.38關m (15關) Gold (Au) Plating, Tube Packaging, without Cap, Lead-free |
| 0878314820 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 48 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0901522160 |
560Kb/8P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 1.0關m (40關) Tin (Sn), 60 Circuits |
| 0878313228 |
201Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 32 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0879112211 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 22 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878982066 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 20 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free |
| 0878314621 |
229Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 46 Circuits, 0.76關m (30關) Gold (Au) Plating, Center Polarization Slot |
| 0901301324 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 24 Circuits, Black, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878312820 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 28 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0877591275 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 12 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0877593464 |
432Kb/8P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |