| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0901301240 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38關m (15關) Gold (Au) Selective Plating |
| 0901301222 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38關m (15關) Gold (Au) Selective Plating |
| 0878980305 |
1Mb/22P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 3 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, without Cap, Lead-free |
| 0879110611 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878310828 |
200Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 8 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0878980666 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 6 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free |
| 0878980524 |
1Mb/22P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38關m (15關) Gold (Au) Plating, Tube Packaging, without Cap, Lead-free |
| 0878980366 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 3 Circuits, 2.50關m (98關) Tin (Sn) Plating, Tray Packaging, without Cap, Lead-free |
| 0878312821 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 28 Circuits, 0.76關m (30關) Gold (Au) Plating, Center Polarization Slot |
| 0879114611 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 46 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878340819 |
126Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, 8 Circuits, 0.13關m (5關) Gold (Au) Plating, Black, without PCBLocator |
| 0877593075 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 30 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0878322422 |
379Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 24 Circuits, 0.38關m (15關) Gold (Au) Plating, Pick-and-Place Cap |
| 0877593475 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, with Pick-and-Place Cap |
| 0901301226 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38關m (15關) Gold (Au) Selective Plating |
| 0901527130 |
89Kb/3P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, 0.76關m (29關) Tin (Sn) Selective, Selective Kinks, 30 Circuits |
| 0879111211 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 12 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0901362132 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 32 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0879115811 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 58 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878325323 |
398Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 8 Circuits, 0.76關m (30關) Gold (Au) Plating, Pick-and-Place Cap |
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