| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0878313620 |
230Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 36 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
| 0877591465 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, |
| 0879117611 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 76 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0877591475 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 14 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0879142815 |
3Mb/48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free |
| 0901362107 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 7 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0877593265 |
292Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs |
| 0877597634 |
367Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 24 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs |
| 0878321023 |
397Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 10 Circuits, 0.76關m (30關) Gold (Au) Plating, Pick-and-Place Ca |
| 0879160001 |
318Kb/7P |
1.00mm (.039) Pitch DDR-2 DIMM Socket, 22.5 Degree Angle, Through Hole, 240 Circuits, 1.8V Voltage Key, 0.76關m (30關) Gold (Au) Plating |
| 0901522116 |
560Kb/8P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 1.0關m (40關) Tin (Sn), 16 Circuits |
| 0878982466 |
1Mb/19P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 24 Circuits , 2.50關m (98關) Tin (Sn) Plating, Tube Packaging, without Cap, Lead-free |
| 0901301338 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.76關m (30關) Gold (Au) Selective Plating |
| 0879110811 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 8 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0901362108 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 8 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0879113211 |
372Kb/6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 32 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free |
| 0878344013 |
106Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13關m (5關) Gold (Au) Selective Plating |
| 0901362103 |
266Kb/5P |
2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 3 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) |
| 0878321822 |
379Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree, 18 Circuits, 0.38關m (15關) Gold (Au) Plating, Pick-and-Place Cap |
| 0878311220 |
234Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, Lead-free, 12 Circuits, 0.38關m (15關) Gold (Au) Plating, Center Polarization Slot |
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