| 制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd.
|
0878351643 |
105Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0879370502 |
102Kb/3P |
2.54mm (.100) Pitch KK짰 Header, Single Row Dual Body, Through Hole, Vertical, 5 Circuits, 2.50關m (100關") Tin (Sn) Plating, 11.00mm (.433) Stacking Height |
| 0901301106 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3關m (118關) Tin (Sn) over Nickel (Ni) |
| 0878351042 |
118Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, Dual Row, Low Profile, Shrouded, 10 Circuits, 0.76關m (30關) Gold (Au) Selective Plating |
| 0878327222 |
379Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 46 Circuits, 0.38關m (15關) Gold (Au) Plating, with Pick-and-Place Cap |
| 0901522318 |
560Kb/8P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 0.76關m (29關) Gold (Au) Selective, 18 Circuits |
| 0879143203 |
770Kb/11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 2.54關m (1.00關) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free |
| 0901522308 |
560Kb/8P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 0.76關m (29關) Gold (Au) Selective, 8 Circuits |
| 0901303314 |
179Kb/4P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black 0.76關m (30關) Gold (Au) Selective Plating |
| 0878980455 |
1Mb/22P |
2.54mm (.100) Pitch KK짰 Header, Surface Mount, Breakaway, Vertical, 4 Circuits, 0.38關m (15關) Gold (Au) Plating, Embossed Tape on Reel Packaging, with Cap |
| 0901522534 |
560Kb/8P |
2.54mm (.100) Pitch C-Grid III??PC Board Connector, Dual Row, Right Angle, Straight PCB Pins 0.125關m (5關) Gold (Au) Selective, 34 Circuits |
| 0879143616 |
3Mb/48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free |
| 0878326023 |
398Kb/6P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 22 Circuits, 0.76關m (30關) Gold (Au) Plating, with Pick-and-Place Cap |
| 0879253000 |
199Kb/4P |
6.35mm (.250) Pitch, Power, 2.54mm (.100) Pitch, Signal, EXTreme PowerPlus??Pa-S Receptacle, Press-fit, Vertical, 0.76關m (30關) Gold (Au)Plating, 33 Circuits |
| 0901303226 |
179Kb/4P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 26 Circuits, Black 0.38關m (15關) Gold (Au) Selective Plating |
| 0878344093 |
111Kb/3P |
2.54mm (.100) Pitch C-Grid짰 Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.76關m (30關) Gold (Au) Plating, End Windows |
| 0901301126 |
596Kb/7P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3關m (118關) Tin (Sn) over Nickel (Ni) |
| 0878321210 |
227Kb/4P |
2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, Shrouded, Leadfree 12 Circuits, 0.38關m (15關) Gold (Au) Plating, with Locking Window, without Cap |
| 0901303208 |
179Kb/4P |
2.54mm (.100) Pitch C-Grid III??Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38關m (15關) Gold (Au) Selective Plating |
| 0879141016 |
3Mb/48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free |
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