GENERAL DESCRIPTIONS
The W25M02GW (2 x 1G-bit) Serial MCP (Multi Chip Package) Flash memory is based on the W25N Serial SLC NAND SpiFlash® series by stacking two individual W25N01GW die into a standard 8-pin package. It offers the highest memory density for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for the first time. The W25M SpiStack® series is ideal for small form factor system designs, and applications that demand high Program/Erase data throughput. All W25N SpiFlash family devices are offered in space-saving packages which were impossible to use in the past for the typical NAND flash memory.

FEATURES
• New Family of SpiFlash Memories
   – W25M02GW: 2x1G-bit / 2x128M-Byte
   – Standard SPI: CLK, /CS, DI, DO, /WP, /HOLD
   – Dual SPI: CLK, /CS, IO0, IO1, /WP, /HOLD
   – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
   – Compatible SPI serial flash commands
• Highest Performance Serial NAND Flash
   – 104MHz Standard/Dual/Quad SPI clocks
   – 208/416MHz equivalent Dual/Quad SPI
   – 40MB/S continuous data transfer rate
   – Fast Program/Erase performance
   – More than 100,000 erase/program cycles
   – More than 10-year data retention
• Efficient “Continuous Read Mode”(1)
   – Alternative method to the Buffer Read Mode
   – No need to issue “Page Data Read” between
      Read commands
   – Allows direct read access to the entire array
• Flexible “Concurrent Operations”
   – Independent single die access
   – Allows “Read while Program/Erase”
   – Allows “Multi Die Program/Erase”
   – Improves Program/Erase throughput
• Low Power, Wide Temperature Range
   – Single 1.70 to 1.95V supply
   – 25mA active, 20µA standby current
   – -40°C to +85°C operating range
• Flexible Architecture with 128KB blocks
   – Uniform 128K-Byte Block Erase
   – Flexible page data load methods
• Advanced Features
   – On chip 1-Bit ECC for memory array
   – ECC status bits indicate ECC results
   – bad block management and LUT(2) access
   – Software and Hardware Write-Protect
   – Power Supply Lock-Down and OTP protection
   – 2KB Unique ID and 2KB parameter pages
   – Ten 2KB OTP pages(3)
• Space Efficient Packaging
   – 8-pad WSON 8x6-mm
   – 24-ball TFBGA 8x6-mm
   – Contact Winbond for other package options