Features
 Serial Peripheral Interface (SPI) with Multi-I/O
– Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Quad peripheral interface (QPI) option
– Extended addressing: 24- or 32-bit address options
– Serial command subset and footprint compatible with S25FL-A,
S25FL1-K, S25FL-P, S25FL-S, and S25FS-S SPI families
– Multi I/O command subset and footprint compatible with S25FL-P,
S25FL-S and S25FS-S SPI families
 Read
– Commands: Normal, Fast, Dual I/O, Quad I/O, DualO, QuadO,
DDR Quad I/O
– Modes: Burst wrap, Continuous (XIP), QPI
– Serial flash discoverable parameters (SFDP) for configuration
information
 Program Architecture
– 256-Bytes page programming buffer
– Program suspend and resume
 Erase Architecture
– Uniform 4 KB sector erase
– Uniform 32 KB half block erase
– Uniform 64 KB block erase
– Chip erase
– Erase suspend and resume
 100,000 Program-Erase Cycles, minimum
 20 Year Data Retention, minimum
 Security Features
– Status and configuration Register protection
– Four security regions of 256-bytes each outside the main Flash
array
– Legacy block protection: Block range
– Individual and region protection
– Individual block lock: Volatile individual sector/block
– Pointer region: Non-volatile sector/block range
– Power supply Lock-down, password, or permanent protection
of security regions 2 and 3 and pointer region
 Technology
– 65-nm Floating Gate technology
 Single Supply Voltage with CMOS I/O
– 2.7 V to 3.6 V
 Temperature Range / Grade
– Industrial (–40°C to +85°C)
– Industrial Plus (–40°C to +105°C)
– Automotive, AEC-Q100 Grade 3 (–40°C to +85°C)
– Automotive, AEC-Q100 Grade 2 (–40°C to +105°C)
– Automotive, AEC-Q100 Grade 1 (–40°C to +125°C)
 Packages (All Pb-free)
– 8-lead SOIC 208 mil (SOC008)
– 16-lead SOIC 300 mil (SO3016)
– USON 4  4 mm (UNF008)
– WSON 5 x 6 mm (WND008)
– BGA-24 6  8 mm
– 5  5 ball (FAB024) footprint
– 4  6 ball (FAC024) footprint
– Known good die and known tested die