制造商 | 部件名 | 数据表 | 功能描述 |
Molex Electronics Ltd. |
0877612001
|
308Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
|
0877615001
|
308Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
|
0877614408
|
106Kb / 3P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
|
0877621633
|
127Kb / 3P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Surface Mount, Vertical, 16 Circuits, 0.76關m (30關) Gold (Au) Selective Plating
|
0791081061
|
304Kb / 6P |
2.00mm (.079") Pitch Milli-Grid??Flex-to-Board Vertical Receptacle Dual Row Through- Hole, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits
|
0791077061
|
278Kb / 5P |
2.00mm (.079") Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.76關m (30關") Gold (Au) Selective Plating, 24 Circuits
|
0877615021
|
309Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
|
0877615022
|
237Kb / 4P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height
|
0877582417
|
182Kb / 4P |
2.00mm (.079") Pitch Milli-Grid??Header, Through Hole, Vertical, 24 Circuits, 0.76關m(30關") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
1510633308
|
45Kb / 2P |
2.00mm Pitch Milli-Grid Header, Through Hole, Single Row, Vertical, 0.75關m Gold Plating
|