FEATURES
• Compact slim body saves space
Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the pack aging density can be increased to allow for much smaller designs.
• Outstanding surge resistance.
Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68)
Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore)
• The use of twin crossbar contacts ensures high contact reliability.
AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating vola tile gas from coil.
• Increased packaging density
Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging
density higher than ever before.
• Nominal operating power: 140 mW
• Outstanding vibration and shock resistance.
Functional shock resistance: 750 m/s2 {75G}
Destructive shock resistance: 1,000 m/s2 {100G}
Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch)
Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch)