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STM32L433CC 数据表(PDF) 206 Page - STMicroelectronics |
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STM32L433CC 数据表(HTML) 206 Page - STMicroelectronics |
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206 / 225 page ![]() Package information STM32L433xx 206/225 DS11449 Rev 5 Figure 56. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package recommended footprint b(3) 0.190 0.220 0.250 0.0075 0.0087 0.0098 D 3.106 3.141 3.176 0.1223 0.1237 0.1250 E 3.092 3.127 3.162 0.1217 0.1231 0.1245 e - 0.350 - - 0.0138 - e1 - 2.450 - - 0.0965 - e2 - 2.450 - - 0.0965 - F - 0.3455 - - 0.0136 - G - 0.3385 - - 0.0133 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 110. WLCSP64 recommended PCB design rules (0.35 mm pitch) Dimension Recommended values Pitch 0.35 mm Dpad 0.210 mm Dsm 0.275 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.235 mm Stencil thickness 0.100 mm Table 109. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max WLCSP49_A04Z_FP_V1 Dpad Dsm |
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