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STM32MP157C 数据表(PDF) 239 Page - STMicroelectronics

部件名 STM32MP157C
功能描述  Arm® dual Cortex®-A7 650 MHz Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto
PDF  258 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32MP157C 数据表(HTML) 239 Page - STMicroelectronics

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DS12505 Rev 2
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STM32MP157C
Package information
254
7
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
7.1
TFBGA 257 package information
Figure 64. TFBGA - 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch
ball grid array package outline
1. Drawing is not to scale.
B02Y_ME_V1
D
E
F1
e1
e2
F2
E2
E1
F1
e2
F2
D2
D1
K
H
D
A
B
C
E
F
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J
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M
N
P
R
U
T
V
W
A
B
1H
1D
1A
1B
1C
1E
1F
1G
1J
Peripheral ball matrix pitch 0.5 mm
Central ball matrix pitch 0.65 mm
1
2
3
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5
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15
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A1 ball pad corner
b (257 balls)
eee M C A B
fff
M C
A
A1
A2
SEATING
PLANE
C
ddd C
BOTTOM VIEW
TOP VIEW
SIDE VIEW
e1



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