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STM32MP151F 数据表(PDF) 235 Page - STMicroelectronics |
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STM32MP151F 数据表(HTML) 235 Page - STMicroelectronics |
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235 / 253 page ![]() DS12501 Rev 3 235/253 STM32MP151C/F Package information 248 Figure 65. TFBGA - Recommended footprint 1. Dimensions are expressed in millimeters. Table 115. TFBGA - Recommended PCB design rules (0.5/0.65 mm pitch, BGA) Dimension Recommended values Pitch 0.5/0.65 mm Dpad 0.230 mm Dsm 0.390 mm typ. Stencil opening 0.230 mm Stencil thickness 0.125 mm to 0.100 mm B02Y_FP_V1 Dpad Dsm |
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