STM32MP151F datasheet(245/253 Pages) STMICROELECTRONICS

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DS12501 Rev 3

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STM32MP151C/F

Package information

248

Figure 74. LFBGA - Recommended footprint

b(2)

0.350

0.400

0.450

0.0138

0.0157

0.0177

17.900

18.000

18.100

0.7047

0.7087

0.7126

16.800

0.6614

17.900

18.000

18.100

0.7047

0.7087

0.7126

16.800

0.6614

0.800

0.0315

0.600

0.0236

ddd

0.120

0.0047

eee(3)

0.150

0.0059

fff(4)

0.080

0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch.

The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The

maximum total package height is calculated by the RSS method (Root Sum Square).

A Max = A1 Typ + A2 Typ + A4 Typ + √(A1² + A2² + A4² tolerance values).

3. The typical ball diameter before mounting is 0.40 mm

4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.

For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true

position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball

must lie within this tolerance zone.

Table 121. LFBGA - Recommended PCB design rules (0.8 mm pitch, BGA)

Dimension

Recommended values

Pitch

0.8 mm

Dpad

0.320 mm

Dsm

0.520 mm typ.

Table 120. LFBGA - Mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

B032_LFBGA448_FP_V1

Dpad

Dsm

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