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STM32MP157C 数据表(PDF) 243 Page - STMicroelectronics |
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STM32MP157C 数据表(HTML) 243 Page - STMicroelectronics |
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243 / 260 page ![]() DS12505 Rev 5 243/260 STM32MP157C/F Package information 254 7.2 LFBGA354 package information This LFBGA is a 354 balls, 16x16 mm, 0.8 mm pitch, low profile fine pitch ball grid array package Figure 67. LFBGA354 - Outline 1. Drawing is not to scale. 2. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each ball must lie simultaneously in both tolerance zones. Table 119. LFBGA354 - Mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A(2) - - 1.290 - - 0.0508 A1(3) 0.250 - - 0.0098 - - A2 - 0.900 - - 0.0354 - b(4) 0.350 0.400 0.450 0.0138 0.0157 0.0177 D 15.850 16.000 16.150 0.6240 0.6299 0.6358 K H D A C E F G J L M N P R U T V W B02Z_ME_V1 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 16 17 18 19 D1 E1 F F e e b (354 balls) eee M C A B fff M C A1 ball pad corner B D E A A1 C SEATING PLANE A BOTTOM VIEW TOP VIEW SIDE VIEW ddd C A2 |
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