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STM32L412RBI3PTR 数据表(PDF) 170 Page - STMicroelectronics |
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STM32L412RBI3PTR 数据表(HTML) 170 Page - STMicroelectronics |
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170 / 192 page  Package information STM32L412xx 170/192 DS12469 Rev 8 Figure 43. UFBGA64 - Recommended footprint Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 95. UFBGA64 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max Table 96. UFBGA64 - Recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm BGA_WLCSP_FT_V1 Dsm Dpad |
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