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STM32L412RBU6XXX 数据表(PDF) 180 Page - STMicroelectronics |
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STM32L412RBU6XXX 数据表(HTML) 180 Page - STMicroelectronics |
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180 / 192 page ![]() Package information STM32L412xx 180/192 DS12469 Rev 8 Device marking The following figure gives an example of topside marking orientation versus ball 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 54. WLCSP36 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. Table 100. WLCSP36 - Recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 0,225 mm Dsm 0.290 mm typ. (depends on soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm MS51421V1 L412B6 A Ball A1 identifier Date code Y WW Product identification(1) Revision code |
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