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STM32L412R8I6XXX 数据表(PDF) 175 Page - STMicroelectronics |
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STM32L412R8I6XXX 数据表(HTML) 175 Page - STMicroelectronics |
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175 / 192 page  DS12469 Rev 8 175/192 STM32L412xx Package information 189 and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 7.4 UFQFPN48 package information This UFQFPN is a 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 49. UFQFPN48 - Outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. A0B9_ME_V3 D Pin 1 identifier laser marking area EE D Y D2 E2 Exposed pad area Z 1 48 Detail Z R 0.125 typ. 1 48 L C 0.500x45° pin1 corner A Seating plane A1 b e ddd Detail Y T |
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