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STM32L412R8Y6XXX 数据表(PDF) 179 Page - STMicroelectronics |
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STM32L412R8Y6XXX 数据表(HTML) 179 Page - STMicroelectronics |
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179 / 192 page ![]() DS12469 Rev 8 179/192 STM32L412xx Package information 189 Figure 53. WLCSP36 - Recommended footprint 1. Dimensions are expressed in millimeters. Table 99. WLCSP36 - Mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A(2) 2. The maximum total package height is calculated by the RSS method (Root Sum Square) using nominal and tolerances values of A1 and A2. - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - A2 - 0.38 - - 0.015 - A3(3) 3. Back side coating. Nominal dimension is rounded to the 3rd decimal place resulting from process capability. - 0.025 - - 0.001 - b 0.22 0.25 0.28 0.009 0.010 0.011 D 2.55 2.58 2.61 0.100 0.102 0.103 E 3.04 3.07 3.10 0.120 0.121 0.122 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - F(4) 4. Calculated dimensions are rounded to the 3rd decimal place - 0.290 - - 0.0114 - G(4) - 0.535 - - 0.0211 - aaa - 0.10 - - 0.004 - bbb - 0.10 - - 0.004 - ccc - 0.10 - - 0.004 - ddd - 0.05 - - 0.002 - eee - 0.05 - - 0.002 - B03P_WLCSP36_DIE464_FP_V1 Dpad Dsm |
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