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数据搜索系统，热门电子元器件搜索 |
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STM32L412RBY3XXX 数据表(PDF) 178 Page - STMicroelectronics |
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STM32L412RBY3XXX 数据表(HTML) 178 Page - STMicroelectronics |
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178 / 192 page  Package information STM32L412xx 178/192 DS12469 Rev 8 7.5 WLCSP36 package information This WLCSP is a 36 balls, 2.58 x 3.07 mm, 0.4 mm pitch, wafer level chip scale package. Figure 52. WLCSP36 - Outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. B03P_WLCSP36_DIE464_ME_V1 A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 C6 D1 D2 D3 D4 D5 D6 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 F G e1 A1 ball location e e D e2 E aaa (4X) BOTTOM VIEW TOP VIEW A A2 DETAIL A A1 bbb Z SIDE VIEW A3 b(36x) eee Z Z SEATING PLANE DETAIL A ROTATED 90 Z Z X Y ccc ddd BUMP FRONT VIEW |
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