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STM32L072KB 数据表(PDF) 136 Page - STMicroelectronics |
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STM32L072KB 数据表(HTML) 136 Page - STMicroelectronics |
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136 / 160 page  Package information STM32L072xx 136/160 DS10689 Rev 5 Figure 54. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 88. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 1.125 mm Pad trace width 0.100 mm Table 87. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball grid array package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max R8_FP_V1 Dpad Dsm |
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