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L9945 数据表(PDF) 142 Page - STMicroelectronics |
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L9945 数据表(HTML) 142 Page - STMicroelectronics |
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142 / 151 page ![]() Table 52. TQFP64 (10x10x1 mm exp. pad down) package mechanical data Ref Min. Typ. Max. Note (see # in Notes below) Ө 0° 3.5° 7° - Ө1 0° - - - Ө2 11° 12° 13° - Ө3 11° 12° 13° - A - - 1.2 15 A1 0.05 - 0.15 12 A2 0.95 1 1.05 15 b 0.17 0.22 0.27 9, 11 b1 0.17 0.2 0.23 11 c 0.09 - 0.2 11 c1 0.09 - 0.16 11 D - 12.00 BSC - 4 D1 - 10.00 BSC - 5, 2 D2 - - 6.4 13 D3 4.8 - - 14 e - 0.50 BSC - - E - 12.00 BSC - 4 E1(*) - 10.00 BSC - 5, 2 E2 - - 6.4 13 E3 4.8 - - 14 L 0.45 0.6 0.75 - L1 - 1.00 REF - - N - 64 - 16 R1 0.08 - - - R2 0.08 - 0.2 - S 0.2 - - - Tolerance of form and position aaa - 0.2 - 1, 7 bbb - 0.2 - ccc - 0.08 - ddd - 0.08 - Notes 1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994. 2. The Top package body size may be smaller than the bottom package size up to 0.15 mm. 3. Datum A-B and D to be determined at datum plane H. 4. To be determined at seating datum plane C. 5. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size dimensions including mold mismatch. L9945 TQFP64 (10x10x1 mm exp. pad down) package information DS12275 - Rev 8 page 142/151 |
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