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STM32G0C1NET6 数据表(PDF) 140 Page - STMicroelectronics |
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STM32G0C1NET6 数据表(HTML) 140 Page - STMicroelectronics |
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140 / 159 page  Package information STM32G0C1xC/xE 140/159 DS13564 Rev 4 6.6 UFBGA64 package information UFBGA64 is a 64-ball, 5 x 5 mm, 0.5 mm pitch ultra-low-profile fine-pitch ball grid array package. Figure 52. UFBGA64 package outline 1. Drawing is not to scale. A019_ME_V1 Seating plane A1 eF F D H Øb (64 balls) A E TOP VIEW BOTTOM VIEW 1 8 e A Y X Z ddd Z D1 E1 eee Z Y X fff Ø Ø M M Z A3 A4 A1 ball identifier A1 ball index area A2 Table 86. UFBGA64 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 0.080 0.130 0.180 0.0031 0.0051 0.0071 A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.170 0.280 0.330 0.0067 0.0110 0.0130 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D1 3.450 3.500 3.550 0.1358 0.1378 0.1398 E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E1 3.450 3.500 3.550 0.1358 0.1378 0.1398 e - 0.500 - - 0.0197 - F 0.700 0.750 0.800 0.0276 0.0295 0.0315 |
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