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ASM330LHB 数据表(PDF) 116 Page - STMicroelectronics |
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ASM330LHB 数据表(HTML) 116 Page - STMicroelectronics |
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116 / 131 page  15 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 15.1 LGA-14L package information Figure 23. LGA-14L 2.5 x 3.0 x 0.86 mm package outline and mechanical data W H 4x (0.1) 14x 0.475±0.05 14x 0.25±0.05 0.5 Pin1 indicator BOTTOM VIEW TOP VIEW 1 C 0.05 C Pin 1 indicator Dimensions are in millimeter unless otherwise specified General tolerance is +/-0.1mm unless otherwise specified OUTER DIMENSIONS ITEM DIMENSION [mm] TOLERANCE [mm] 1 . 0 ± 0 5 . 2 ] L [ h t g n e L 1 . 0 ± 0 0 . 3 ] W [ h t d i W X A M 6 8 . 0 ] H [ t h g i e H DM00249496_5 ASM330LHB Package information DS13773 - Rev 7 page 116/131 |
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