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PIC16F506T-E/MS 数据表(PDF) 101 Page - Microchip Technology |
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PIC16F506T-E/MS 数据表(HTML) 101 Page - Microchip Technology |
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101 / 116 page ![]() © 2007 Microchip Technology Inc. Preliminary DS41268C-page 99 PIC12F510/16F506 15.0 PACKAGING 15.1 Package Marking Information XXXXXNNN 8-Lead PDIP XXXXXXXX YYWW 017 Example 12F510/P 0410 14-Lead PDIP XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example PIC16F506-I/P 0410017 8-Lead SOIC (3.90 mm) XXXXXXXX XXXXYYWW NNN Example PIC12F510-I /SN0410 017 X X X Y W W N N 8-Lead 2x3 DFN* B E 0 6 1 0 1 7 Example * Standard PIC® device marking consists of Microchip part number, year code, week code and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e |
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