PIC16F506T-ESLASHMS datasheet(106/116 Pages) MICROCHIP

106 / 116 page

PIC12F510/16F506

DS41268C-page 104

Preliminary

8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

0.50 BSC

Overall Height

0.80

0.90

1.00

Standoff

0.00

0.02

0.05

Contact Thickness

0.20 REF

Overall Length

2.00 BSC

Overall Width

3.00 BSC

Exposed Pad Length

1.30

–

1.75

Exposed Pad Width

1.50

–

1.90

Contact Width

0.18

0.25

0.30

Contact Length

0.30

0.40

0.50

Contact-to-Exposed Pad

0.20

–

NOTE 1

EXPOSED PAD

NOTE 1

NOTE 2

BOTTOM VIEW

TOP VIEW

Microchip Technology Drawing C04-123B

PIC16F506T-E/MS 数据表(PDF) 106 Page - Microchip Technology

PIC16F506T-E/MS 数据表(HTML) 106 Page - Microchip Technology

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