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STM32G474CEU6 数据表(PDF) 214 Page - STMicroelectronics |
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STM32G474CEU6 数据表(HTML) 214 Page - STMicroelectronics |
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214 / 232 page  Package information STM32G474xB STM32G474xC STM32G474xE 214/232 DS12288 Rev 1 6.5 LQFP80 package information Figure 64. LQFP - 80 pins, 12 x 12 mm low-profile quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. Table 116. LQFP - 80 pins, 12 x 12 mm low-profile quad flat package mechanical data Symbol Millimeters inches(1) Min Typ Max Min Typ Max A - - 1.600 - - 0.0630 A1 0.050 - 0.150 0.0020 - 0.0059 A2 1.350 1.400 1.450 0.0531 0.0551 0.0571 b 0.170 0.220 0.270 0.0067 0.0087 0.0106 c 0.090 - 0.200 0.0035 - 0.0079 |
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