STM32F412RGT3P datasheet(142/201 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F412xE/G

142/201

DocID028087 Rev 7

Equation 1: RAIN max formula

The formula above (Equation 1) is used to determine the maximum external impedance

allowed for an error below 1/4 of LSB. N = 12 (from 12-bit resolution) and k is the number of

sampling periods defined in the ADC_SMPR1 register.

fS(2)

Sampling rate

(fADC = 30 MHz, and

tS = 3 ADC cycles)

12-bit resolution

Single ADC

Msps

12-bit resolution

Interleave Dual ADC

mode

3.75

Msps

12-bit resolution

Interleave Triple ADC

mode

Msps

IVREF+(2)

ADC VREF DC current

consumption in conversion

mode

300

500

µA

IVDDA(2)

ADC VDDA DC current

consumption in conversion

mode

1.6

1.8

1. VDDA minimum value of 1.7 V is possible with the use of an external power supply supervisor (refer to Section 3.18.2:

Internal reset OFF).

2. Guaranteed by characterization, not tested in production.

3. VREF+ is internally connected to VDDA and VREF- is internally connected to VSSA.

4. RADC maximum value is given for VDD=1.7 V, and minimum value for VDD=3.3 V.

5. For external triggers, a delay of 1/fPCLK2 must be added to the latency specified in Table 72.

Table 72. ADC characteristics (continued)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 73. ADC accuracy at fADC = 18 MHz(1)

1. Better performance could be achieved in restricted VDD, frequency and temperature ranges.

Symbol

Parameter

Test conditions

Typ

Max(2)

2. Guaranteed by characterization, not tested in production.

Unit

Total unadjusted error

fADC =18 MHz

VDDA = 1.7 to 3.6 V

VREF = 1.7 to 3.6 V

VDDA −VREF < 1.2 V

±3

±4

LSB

Offset error

±2

±3

Gain error

±1

±3

Differential linearity error

±1

±2

Integral linearity error

±2

±3

RAIN

k0.5

–

()

fADC CADC

()

----------------------------------------------------------------

RADC

–

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