STM32F412RGT7 datasheet(188/201 Pages) STMICROELECTRONICS

部件名	STM32F412RGT7

功能描述	Arm®-Cortex®-M4 32b MCUFPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces

PDF	201 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

188 / 201 page

Package information

STM32F412xE/G

188/201

DocID028087 Rev 7

Figure 79. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball

grid array recommended footprint

Note:

Non solder mask defined (NSMD) pads are recommended.

4 to 6 mils solder paste screen printing process.

Stencil opening is 0.400 mm.

Stencil thickness is between 0.100 mm and 0.125 mm.

Pad trace width is 0.120 mm.

0.550

0.600

0.650

0.0217

0.0236

0.0256

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.080

0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 108. UFBGA144 recommended PCB design rules (0.80 mm pitch BGA)

Dimension

Recommended values

Pitch

0.80 mm

Dpad

0.400 mm

Dsm

0.550 mm typ. (depends on the soldermask

registration tolerance)

Table 107. UFBGA144 - 144-pin, 10 x 10 mm, 0.80 mm pitch, ultra fine pitch ball

grid array package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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