STM32L412R8Y6 datasheet(168/192 Pages) STMICROELECTRONICS

部件名	STM32L412R8Y6

功能描述	Ultra-low-power Arm® Cortex®-M4 32-bit MCUFPU, 100DMIPS, up to 128KB Flash, 40KB SRAM, analog, ext. SMPS

PDF	192 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

168 / 192 page

Package information

STM32L412xx

168/192

DS12469 Rev 4

Figure 41. UFBGA64 – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array package recommended footprint

0.500

0.0197

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 95. UFBGA – 64 balls, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.460

0.530

0.600

0.0181

0.0209

0.0236

Table 96. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.100 mm

STM32L412R8Y6 数据表(PDF) 168 Page - STMicroelectronics

STM32L412R8Y6 数据表(HTML) 168 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

数据表下载