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STM32L412RBU3 数据表(PDF) 185 Page - STMicroelectronics |
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STM32L412RBU3 数据表(HTML) 185 Page - STMicroelectronics |
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185 / 192 page  DS12469 Rev 4 185/192 STM32L412xx Package information 189 Figure 56. LQFP - 32 pins, 7 x 7 mm low-profile quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 57. LQFP32 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in |
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