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STM32L412RBI3P 数据表(PDF) 187 Page - STMicroelectronics |
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STM32L412RBI3P 数据表(HTML) 187 Page - STMicroelectronics |
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187 / 192 page  DS12469 Rev 4 187/192 STM32L412xx Package information 189 7.8 Thermal characteristics The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of all IDDXXX and VDDXXX, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 7.8.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org 7.8.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Section 8: Ordering information. Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to a specific maximum junction temperature. Table 103. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient LQFP64 - 10 × 10 mm / 0.5 mm pitch 66 °C/W Thermal resistance junction-ambient UFBGA64 - 5 × 5 mm / 0.5 mm pitch 63 Thermal resistance junction-ambient UFQFPN48 - 7 × 7 mm / 0.5 mm pitch 30 Thermal resistance junction-ambient LQFP48 - 7 × 7 mm / 0.5 mm pitch 68 Thermal resistance junction-ambient WLCSP36 - 2.58 x 3.07 mm / 0.4 mm pitch 85 Thermal resistance junction-ambient LQFP32 - 7 x 7 / 0.8 mm pitch 68 Thermal resistance junction-ambient UFQFPN32- 5 × 5 mm / 0.5 mm pitch 37 |
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