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STM32L412R8I3TR 数据表(PDF) 180 Page - STMicroelectronics |
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STM32L412R8I3TR 数据表(HTML) 180 Page - STMicroelectronics |
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180 / 192 page  Package information STM32L412xx 180/192 DS12469 Rev 4 Figure 51. WLCSP36 marking (package top view) 1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality department must be contacted prior to any decision to use these engineering samples to run a qualification activity. 7.6 UFQFPN32 package information Figure 52. UFQFPN - 32 pins, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. |
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