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STM32L412R8Y3TR 数据表(PDF) 174 Page - STMicroelectronics |
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STM32L412R8Y3TR 数据表(HTML) 174 Page - STMicroelectronics |
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174 / 192 page ![]() Package information STM32L412xx 174/192 DS12469 Rev 4 7.4 UFQFPN48 package information Figure 46. UFQFPN - 48 leads, 7x7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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