ST72104G datasheet(128/135 Pages) STMICROELECTRONICS

128 / 135 page

ST72104G, ST72215G, ST72216G, ST72254G

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14.3 SOLDERING AND GLUEABILITY INFORMATION

Recommended soldering information given only

as design guidelines in Figure 98 and Figure 99.

Recommended glue for SMD plastic packages

dedicated to molding compound with silicone:

Heraeus: PD945, PD955

Loctite: 3615, 3298

Figure 98. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)

Figure 99. Recommended Reflow Soldering Oven Profile (MID JEDEC)

14.4 PACKAGE/SOCKET FOOTPRINT PROPOSAL

Table 21. Suggested List of SDIP32 Socket Types

Table 22. Suggested List of SO28 Socket Types

Package / Probe

Adaptor / Socket Reference

Same

Footp rint

Socket Type

SDIP32

EMU PROBE

TEXTOOL

232-1291-00

Textool

Package / Probe

Adaptor / Socket Reference

Same

Footp rint

Socket Type

SO28

ENPLAS

OTS-28-1.27-04

Open Top

YAMAICHI

IC51-0282-334-1

Clamshell

EMU PROBE

Adapter from SO28 to SDIP32 footprint (delivered with emulator)

SMD to SDIP

250

200

150

100

120

160

Time [sec]

Temp. [

°C]

100

140

5 sec

COOLING PHASE

(ROOM TEMPERATURE)

PREHEATING

°C

PHASE

SOLDERING

PHASE

250

200

150

100

200

300

400

Time [sec]

Temp. [

°C]

ramp up

°C/sec for 50sec

90 sec at 125

°C

150 sec above 183

°C

ramp down natural

°C/sec max

Tmax=220+/-5

°C

for 25 sec

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