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PSMN1R7-30YL 数据表(PDF) 2 Page - NXP Semiconductors

部件名 PSMN1R7-30YL
功能描述  N-channel TrenchMOS logic level FET
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制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

PSMN1R7-30YL 数据表(HTML) 2 Page - NXP Semiconductors

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PSMN1R7-30YL_1
© NXP B.V. 2008. All rights reserved.
Preliminary data sheet
Rev. 01 — 11 September 2008
2 of 13
NXP Semiconductors
PSMN1R7-30YL
N-channel TrenchMOS logic level FET
2.
Pinning information
3.
Ordering information
4.
Limiting values
[1]
Continuous current is limited by package.
Table 2.
Pinning information
Pin
Symbol
Description
Simplified outline
Graphic symbol
1S
source
SOT669
(LFPAK)
2S
source
3S
source
4G
gate
mb
D
mounting base; connected to
drain
mb
123 4
S
D
G
mbb076
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PSMN1R7-30YL
LFPAK
Plastic single-ended surface-mounted package (LFPAK); 4 leads
SOT669
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj ≥ 25 °C; Tj ≤ 150 °C
-
30
V
VDGR
drain-gate voltage
Tj ≥ 25 °C; Tj ≤ 150 °C; RGS =20kΩ
-30
V
VGS
gate-source voltage
-20
20
V
ID
drain current
VGS =10V; Tmb = 100 °C; see Figure 1;
[1]
-100
A
VGS =10V; Tmb =25°C; see Figure 1; see Figure
3;
[1]
-100
A
IDM
peak drain current
tp ≤ 10 µs; pulsed; Tmb =25°C; see Figure 3
-790
A
Ptot
total power dissipation
Tmb =25°C; see Figure 2
-109
W
Tstg
storage temperature
-55
150
°C
Tj
junction temperature
-55
150
°C
Source-drain diode
IS
source current
Tmb =25°C;
[1]
-100
A
ISM
peak source current
tp ≤ 10 µs; pulsed; Tmb =25°C
-
790
A
Avalanche ruggedness
EDS(AL)S
non-repetitive
drain-source avalanche
energy
VGS =10V; Tj(init) =25°C; ID =100 A; Vsup ≤ 30 V;
RGS =50 Ω; unclamped
-241
mJ


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