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EP2A70 数据表(PDF) 7 Page - Altera Corporation |
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EP2A70 数据表(HTML) 7 Page - Altera Corporation |
7 / 99 page Altera Corporation 7 APEX II Programmable Logic Device Family Data Sheet Each I/O pin is fed by an IOE located at the end of each row and column of the FastTrack interconnect. Each IOE contains a bidirectional I/O buffer and six registers that can be used for registering input, output, and output-enable signals. When used with a dedicated clock pin, these registers provide exceptional performance and interface support with external memory devices such as DDR SDRAM and ZBT and QDR SRAM devices. IOEs provide a variety of features such as: 3.3-V, 64-bit, 66-MHz PCI compliance, 3.3-V, 64-bit, 133-MHz PCI-X compliance, Joint Test Action Group (JTAG) boundary-scan test (BST) support, output drive strength control, slew-rate control, tri-state buffers, bus-hold circuitry, programmable pull-up resistors, programmable input and output delays, and open-drain outputs. APEX II devices offer enhanced I/O support, including support for 1.5 V, 1.8 V, 2.5 V, 3.3 V, LVCMOS, LVTTL, HSTL, LVDS, LVPECL, HyperTransport, PCML, 3.3-V PCI, PCI-X, GTL+, SSTL-2, SSTL-3, CTT, and 3.3-V AGP I/O standards. High-speed (up to 1.0 Gbps) differential transfers are supported with True-LVDS circuitry for LVDS, LVPECL, HyperTransport, and PCML I/O standards. The optional CDS feature corrects any clock-to-data skew at the True-LVDS receiver channels, allowing for flexible board topologies. Up to 88 Flexible-LVDS channels support differential transfer at up to 400 Mbps (DDR) for LVDS and HyperTransport I/O standards. An ESB can implement many types of memory, including Dual-Port+ RAM, CAM, ROM, and FIFO functions. Embedding the memory directly into the die improves performance and reduces die area compared to distributed-RAM implementations. The abundance of cascadable ESBs ensures that the APEX II device can implement multiple wide memory blocks for high-density designs. The ESB’s high speed ensures it can implement small memory blocks without any speed penalty. The abundance of ESBs, in conjunction with the ability for one ESB to implement two separate memory blocks, ensures that designers can create as many different-sized memory blocks as the system requires. Figure 1 shows an overview of the APEX II device. |
类似零件编号 - EP2A70 |
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类似说明 - EP2A70 |
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