STM32F103xC datasheet(109/123 Pages) STMICROELECTRONICS

部件名	STM32F103xC

功能描述	High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

PDF	123 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

109 / 123 page

STM32F103xC, STM32F103xD, STM32F103xE

Package characteristics

Doc ID 14611 Rev 7

109/123

Figure 61.

WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale

package outline

Drawing is not to scale.

Primary datum Z and seating plane are defined by the spherical crowns of the ball.

Table 66.

WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale

package mechanical data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.535

0.585

0.635

0.0211

0.0230

0.0250

0.205

0.230

0.255

0.0081

0.0091

0.0100

0.330

0.355

0.380

0.0130

0.0140

0.0150

b(2)

Dimension is measured at the maximum ball diameter parallel to primary datum Z.

0.290

0.320

0.350

0.0114

0.0126

0.0138

0.500

0.0197

3.500

0.1378

0.447

0.0176

0.483

0.0190

4.446

4.466

4.486

0.1750

0.1758

0.1766

4.375

4.395

4.415

0.1722

0.1730

0.1738

0.250

0.0098

0.200

0.0079

eee

0.05

0.0020

aaa

0.10

0.0039

Number of balls

Detail A

Side view

Ball side

Wafer back side

Marking area

A1 ball corner

Notch

Ball

Seating plane (see note 2)

Detail A rotated 90 ˚

CR_ME

aaa

eee

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